nanoSkunkWorkX

Develops graphene-copper thin-film interfaces that improve heat and current handling in AI chip packaging. Source

Category

AI

Headquarters

Malaysia

Status

Private

nanoSkunkWorkX on fru.dev

• Funding rounds: Seed (2026-09)

Sources

• www.digitalnewsasia.com/startups/malaysian-deep-tech-startup-nanoskunkworkx-rais