nanoSkunkWorkX

Develops graphene-copper thin-film interfaces that improve heat and current handling in AI chip packaging. Source

Category

Hardware

Headquarters

Malaysia

Status

Private

nanoSkunkWorkX across Glyph

• Funding rounds: Funding rounds
• Leadership moves: 2 leaders
• Paydays: Pay schedule
• Official socials

nanoSkunkWorkX across Glyph: timeline

1. 2026-09-02 Seed round, $2M (Funding)

Sources

• www.digitalnewsasia.com/startups/malaysian-deep-tech-startup-nanoskunkworkx-rais